A Comprehensive Study of Interface Damage at Cu/Polyimide Interface in Redistribution Layers of Fan-out Wafer Level Packaging-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A Comprehensive Study of Interface Damage at Cu/Polyimide Interface in Redistribution Layers of Fan-out Wafer Level Packaging

Published:2023-08-08 Issue: Volume:52 Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Zhou Shilu¹,Zhong Cheng¹,Shan Liang¹,Zhang Guoping¹,Lu Jibao¹,Sun Rong¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced of Technology,Shenzhen,China,518055

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10491916.pdf?arnumber=10491916

Reference6 articles.

1. Development of advanced fan-out wafer level package[C];Jin

2. Fan-Out Wafer Level Packaging Development Line

3. Study on the board-level drop test of WLCSP with RDL by finite element analysis

4. A Comprehensive Study on Stress and Warpage by Design, Simulation and Fabrication of RDL-First Panel Level Fan-Out Technology for Advanced Package

5. A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP