Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects
Author:
Affiliation:
1. Advanced Semiconductor Engineering (ASE) Inc,Kaohsiung,Taiwan, R.O.C,811
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535603.pdf?arnumber=10535603
Reference4 articles.
1. A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect
2. A combined simulation and experimental study on cracking and delamination behavior at the Cu/Polyimide interface of RDLs in chiplet package subjected to thermo-mechanical loads
3. Reliability Challenges of High-Density Fan-out Packaging for High-Performance Computing Applications
4. Analysis the interface delamination of Cu and EMC adhesive material in the cutting process of electronic chip based on cohesive zone modeling
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