FOWLP and Si-Interposer for High-Speed Photonic Packaging
Author:
Funder
A*STAR
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501535.pdf?arnumber=9501535
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Solutions for Process Challenges on Fan-Out Wafer Level Packaging of Electronic-Photonic Integration;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. RF Characterization and Analysis of Coplanar Waveguide on Various Silicon Wafers for 2.5D Integration;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
3. Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer;Processes;2022-11-10
4. Recent Trends in Optical Packaging Technologies;Journal of The Japan Institute of Electronics Packaging;2022-01-01
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