RF Characterization and Analysis of Coplanar Waveguide on Various Silicon Wafers for 2.5D Integration
Author:
Affiliation:
1. Institute of Microelectronics, A*STAR,Singapore
Funder
National Research Foundation
DSO National Laboratories, Singapore
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013201.pdf?arnumber=10013201
Reference9 articles.
1. Heterogeneous system implementation using through-silicon interposer (TSI) technology
2. Highly Compact RF Transceiver Module Using High Resistive Silicon Interposer with Embedded Inductors and Heterogeneous Dies Integration
3. Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices
4. FOWLP and Si-Interposer for High-Speed Photonic Packaging
5. A 2.5D Heterogeneous Integration Demonstration for High Performance RF Application using High-Resistivity Through Si Interposer (TSI)
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