Highly Compact RF Transceiver Module Using High Resistive Silicon Interposer with Embedded Inductors and Heterogeneous Dies Integration-Reference-Cited by-同舟云学术

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Highly Compact RF Transceiver Module Using High Resistive Silicon Interposer with Embedded Inductors and Heterogeneous Dies Integration

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Pares G.,Jean-Philippe Michel,Edouard Deschaseaux,Pierre Ferris,Ayssar Serhan,Alexandre Giry

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811198.pdf?arnumber=8811198

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23

2. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01

3. Multiple System and Heterogeneous Integration with TSV-Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023

4. RF Characterization and Analysis of Coplanar Waveguide on Various Silicon Wafers for 2.5D Integration;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

5. Recent Advances and Trends in Advanced Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-02

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