Abstract
The new generation of data centers is further evolving towards the direction of high speed and intelligence, which puts forward a great demand for the iteration of optical interconnection technology. Three-dimensional integration based on active photonic interposers can achieve the advantages of high integration, high bandwidth and low power consumption, which has become the main direction for next generation optical module technology. The fabrication and assembly of 3D optical modules based on active interposer-integrated edge couplers and TSV are realized in this paper. Different active interposer processes with integrated edge couplers and RDL-TSV-RDL structures are discussed, manufactured, analyzed and evaluated. The problem of the co-fabrication of the TSV and edge coupler was solved, and perfect electrical and optical characteristics were also achieved. Finally, the fabrication of the substrate and the assembly of the 3D optical module were completed. This paper lays a solid foundation for the further research and large-scale application of 3D optical modules in the future.
Funder
National Key Research and Development Program of China
Subject
Process Chemistry and Technology,Chemical Engineering (miscellaneous),Bioengineering
Reference24 articles.
1. Co-packaged datacenter optics: Opportunities and challenges;Minkenberg;IET Optoelectron.,2021
2. The path to 1Tb/s and beyond datacenter interconnect networks: Technologies, components, and subsystems;Spyropoulou;Metro Data Cent. Opt. Netw. Short-Reach. Links IV,2021
3. 1.6 Tbps silicon photonics integrated circuit and 800 Gbps photonic engine for switch co-packaging demonstration;Fathololoumi;J. Light. Technol.,2020
4. Lorenz, L., Hanesch, F., Nieweglowski, K., Hamjah, M.K., Franke, J., Hoffmann, G.A., and Bock, K. Reliability of 3D-Opto-MID Packages for Asymmetric Optical Bus Couplers. Proceedings of the 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021.
5. Silicon photonic 2.5 d multi-chip module transceiver for high-performance data centers;Abrams;J. Light. Technol.,2020
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