Thermal Stability and Failure Mechanism of Schottky Gate AlGaN/GaN HEMTs

Author:

Mocanu Manuela1ORCID,Unger Christian2,Pfost Martin2,Waltereit Patrick3,Reiner Richard3

Affiliation:

1. Robert Bosch Center for Power Electronics, Reutlingen University, Reutlingen, Germany

2. Chair of Energy Conversion, Technical University of Dortmund, Dortmund, Germany

3. Fraunhofer Institute for Applied Solid State Physics, Freiburg, Germany

Funder

German Federal Ministry of Education and Research

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Thermal Modeling and Layout Optimization of GaN Half-Bridge IC with Integrated Drivers and Power HEMTs;Russian Microelectronics;2024-06

2. Temperature-Dependent Thermal Impedance Measurement of GaN-Based HEMTs Using Transient Thermoreflectance;IEEE Transactions on Electron Devices;2024-04

3. A Comprehensive Study on AlGaN/GaN-Based HEMT for High-Speed;International Journal of High Speed Electronics and Systems;2024-02-23

4. Topological Mott transistor with high current density based on hydrogen-terminated diamond;Applied Physics Letters;2023-12-25

5. Thermal Modelling of Monolithic Half-bridge IC with Integrated Gate Drivers and Power e-HEMT Based on GaN-on-SOI Platform;2023 IEEE XVI International Scientific and Technical Conference Actual Problems of Electronic Instrument Engineering (APEIE);2023-11-10

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