Author:
Sodan Vice,Kosemura Daisuke,Stoffels Steve,Oprins Herman,Baelmans Martine,Decoutere Stefaan,De Wolf Ingrid
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Novel Temperature Estimation Technique Exploiting Carrier Emission from Buffer Traps;ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC);2022-09-19
2. Gate resistance thermometry: An electrical thermal characterization technique;Thermal Management of Gallium Nitride Electronics;2022
3. Thermal characterization of GaN lateral power HEMTs on Si, SOI, and poly-AlN substrates;Microelectronics Reliability;2021-03
4. Measuring Thermal Resistance of GaN HEMTs Using Modulation Method;IEEE Transactions on Electron Devices;2020-10
5. Thermal resistance characterization of GaN power HEMTs on Si, SOI, and poly-AlN substrates;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07