Carrier Trapping Effects on Forward Characteristics of SiC p-i-n Diodes Fabricated on High-Purity Semi-Insulating Substrates
Author:
Affiliation:
1. Department of Electronic Science and Engineering, Kyoto University, Kyoto, Japan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/9741401/09732529.pdf?arnumber=9732529
Reference39 articles.
1. Electrical properties of n- and p-type 4H-SiC formed by ion implantation into high-purity semi-insulating substrates
2. Incomplete ionization in aluminum-doped 4H-silicon carbide
3. Measurement of Hall Mobility in 4H-SiC for Improvement of the Accuracy of the Mobility Model in Device Simulation
4. Statistics of the Recombinations of Holes and Electrons
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1. Experimental and Simulation Study of Single-Event Leakage Current Degradation and Damage Mechanism in 4H-SiC PiN Diodes;IEEE Transactions on Electron Devices;2024-08
2. Carrier transport simulation methods for electronic devices with coexistence of quantum transport and diffusive transport;Journal of Applied Physics;2024-06-11
3. Investigation of Two High-Temperature Bipolar Phenomena and Characteristics of 1.2-kV SiC Power Diodes for High-Temperature Applications;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-02
4. Nearly Ideal Breakdown Voltage Observed in Lateral p-i-n Diodes Fabricated on a SiC High-Purity Semi-Insulating Substrate;IEEE Transactions on Electron Devices;2023-04
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