Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal-Reference-Cited by-同舟云学术

Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal

Published:2023-08 Issue:4 Volume:32 Page:389-397
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Gong Tianjiao¹^ORCID,Suzuki Yukio¹,Khan Muhammad Jehanzeb¹,Hiller Karla²^ORCID,Tanaka Shuji¹^ORCID

Affiliation:

1. Robotics of Department, Tohoku University, Sendai, Japan

2. Fraunhofer Institute for Electronic Nano Systems, Chemnitz, Germany

Funder

New Energy and Industrial Technology Development Organization

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx7/84/10198872/10158323.pdf?arnumber=10158323

Reference26 articles.

1. A review: crystalline silicon membranes over sealed cavities for pressure sensors by using silicon migration technology

2. Experimental Investigation of Silicon Surface Migration in Low Pressure Nonreducing Gas Environments

3. Improved Vacuum Level of Silicon-Migration-Sealed Cavity by Hydrogen Diffusion Annealing For Wafer-Level Packaging For Mems

4. Silicon migration seal wafer‐level vacuum encapsulation

5. Thermal Annealing in Hydrogen for 3-D Profile Transformation on Silicon-on-Insulator and Sidewall Roughness Reduction

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1. Vacuum-Sealed MEMS Resonators Based on Silicon Migration Sealing and Hydrogen Diffusion;Journal of Microelectromechanical Systems;2024-06

2. Characterization of plasma-activated, thermally-annealed Si-SiO2 direct bond strength for vapor HF etching;Sensors and Actuators A: Physical;2023-12