Improved Vacuum Level of Silicon-Migration-Sealed Cavity by Hydrogen Diffusion Annealing For Wafer-Level Packaging For Mems
Author:
Affiliation:
1. Tohoku University,JAPAN
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9698823/9699435/09699602.pdf?arnumber=9699602
Reference6 articles.
1. Silicon Migration Seal Wafer-Level Vacuum Encapsulation
2. Silicon Migration Seal for Wafer-Level Vacuum Encapsulation
3. Wafer-level hermetic vacuum packaging by bonding with a copper–tin thin film sealing ring
4. Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting;al farisi;J Micromech Microeng,2016
5. Low-Stress Epitaxial Polysilicon Process for Micromirror Devices
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1. Characterization of plasma-activated, thermally-annealed Si-SiO2 direct bond strength for vapor HF etching;Sensors and Actuators A: Physical;2023-12
2. Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal;Journal of Microelectromechanical Systems;2023-08
3. Mems Resonator Vacuum-Sealed by Silicon Migration and Hydrogen Outdiffusion;2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS);2023-01-15
4. Characterization of Vapor HF Sacrificial Etching Through Submicron Relase Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal;2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS);2023-01-15
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