Low-Stress Epitaxial Polysilicon Process for Micromirror Devices-Reference-Cited by-同舟云学术

Low-Stress Epitaxial Polysilicon Process for Micromirror Devices

Published:2013 Issue:6 Volume:133 Page:223-228
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Suzuki Yukio¹,Totsu Kentaro¹,Watanabe Hiraku¹,Moriyama Masaaki¹,Esashi Masayoshi²,Tanaka Shuji³

Affiliation:

1. Micro System Integration Center, Tohoku University

2. World Premier International Research Center Advanced Institute for Materials Research, Tohoku University

3. Department of Nanomechanics, Graduate School of Engineering, Tohoku University

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/ieejsmas/133/6/133_223/_pdf

Reference18 articles.

1. (1) H.-H. Kiang, O. Solgaard, R. S. Muller, and K. Y. Lau : “Micromachined Polysilicon Microscanners for Barcode Readers”, IEEE Photonics Technology Letters, Vol.8, No.12, pp.1707-1709 (1996)

2. (2) C. Tsuou, W. T. Lin, C. C. Fan, and B. C. S. Shou : “A novel self-aligned vertical electrostatic combdrives actuator for scanning micromirrors”, Journal of Micromechanics and Microenginerring, Vol.15, pp.855-860 (2005)

3. (3) M. C. Wu, O. Solgaard, and J. E. Ford : “Optical MEMS for Lightwave Communication” Journal of Lightwave Technology, Vol.24, No.12, pp.4433-4454 (2006)

4. (4) N. Asada, H. Matsuki, K. Minami, and M. Esashi : “Silicon Micromachined Tow-Dimensional Galvno Optical Scanner” IEEE Transactions on Magnetics, Vol.30, No.6, pp.4647-4649 (1994)

5. (5) Y. Mizoguchi and M. Esashi : “Design and Fabrication of a Pure-Rotation Microscanner with Self-Aligned Electrostatic Vertical Combdrives in Double SOI wafer”, Digest of Technical Papers, Transducers '05, pp.65-68 (2005)

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Vacuum-Sealed MEMS Resonators Based on Silicon Migration Sealing and Hydrogen Diffusion;Journal of Microelectromechanical Systems;2024-06

2. Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal;Journal of Microelectromechanical Systems;2023-08

3. Mems Resonator Vacuum-Sealed by Silicon Migration and Hydrogen Outdiffusion;2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS);2023-01-15

4. Characterization of Vapor HF Sacrificial Etching Through Submicron Relase Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal;2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS);2023-01-15

5. Improved Vacuum Level of Silicon-Migration-Sealed Cavity by Hydrogen Diffusion Annealing For Wafer-Level Packaging For Mems;2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS);2022-01-09