Author:
Gong Tianjiao,Suzuki Yukio,Hiller Karla,Tanaka Shuji
Funder
Government of Japan Ministry of Education Culture Sports Science and Technology
New Energy and Industrial Technology Development Organization
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Silicon-to-silicon direct bonding method;Shimbo;J. Appl. Phys.,1986
2. Silicon-on-insulator (SOI) by bonding and etch-back;Lasky,1985
3. Semiconductor wafer bonding;Gösele;Annu. Rev. Mater. Sci.,1998
4. Silicon migration seal wafer-level vacuum encapsulation”;Suzuki;Elect. Comm. Jpn.,2021
5. H. Suzuki, Y. Suzuki, Y. Kanamori , S. Tanaka, Improved Vacuum Level of Silicon-Migration-Sealed Cavity by Hydrogen Diffusion Annealing For Wafer-Level Packaging For Mems, 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Tokyo, Japan, 2022, pp. 565–568.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献