Silicon migration seal wafer‐level vacuum encapsulation
Author:
Affiliation:
1. Tohoku University 6‐6‐01, Aramaki‐aza‐Aoba, Aoba‐ku Sendai Miyagi 980–8579 Japan
2. INSA Lyon 20 Avenue Albert Einstein Villeurbanne cedex 69621 France
Publisher
Wiley
Subject
Applied Mathematics,Electrical and Electronic Engineering,Computer Networks and Communications,General Physics and Astronomy,Signal Processing
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/ecj.12283
Reference12 articles.
1. New Thin Film Epitaxial Polysilicon Encapsulation for Piezoresistive Accelerometers;Partridge A;Proc IEEE MEMS,2001
2. Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators
3. Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators
4. A Unified Epi‐Seal Process for Fabrication of High‐Stability Microelectromechanical Devices;Yang Y;J Microelectromech Syst,2016
5. Deposition of thick doped polysilicon films with low stress in an epitaxial reactor for surface micromachining applications;Kirsten M;Thin Solid Films,1995
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Vacuum-Sealed MEMS Resonators Based on Silicon Migration Sealing and Hydrogen Diffusion;Journal of Microelectromechanical Systems;2024-06
2. Characterization of plasma-activated, thermally-annealed Si-SiO2 direct bond strength for vapor HF etching;Sensors and Actuators A: Physical;2023-12
3. Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal;Journal of Microelectromechanical Systems;2023-08
4. Mems Resonator Vacuum-Sealed by Silicon Migration and Hydrogen Outdiffusion;2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS);2023-01-15
5. Characterization of Vapor HF Sacrificial Etching Through Submicron Relase Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal;2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS);2023-01-15
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3