A Method to Measure Residual Stress of Liquid Molding Compound by In-Situ Characterizations-Reference-Cited by-同舟云学术

A Method to Measure Residual Stress of Liquid Molding Compound by In-Situ Characterizations

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhang Mengdi¹,Ai Wenji²,Xie Xin³,Fu Kexin²,Zhu Pengli¹,Sun Rong¹

Affiliation:

1. Chinese Academy of Sciences Suzhou,Nano Science and Technology Institute University of Science and Technology of China Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,China/ Shenzhen,China,518055

2. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

3. Chinese Academy of Sciences State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources North China Electric Power University Shenzhen,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,China/ Beijing,China,518055

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873255.pdf?arnumber=9873255

Reference12 articles.

1. Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

2. A Flip-Chip Alignment System With the Property of Deviation Self-Correction at the Nanoscale

3. Spatial and temporal changes in physical properties of epoxy during curing and their effects on the residual stresses and properties of cured epoxy and composites

4. Low stress polyimide/silica nanocomposites as dielectrics for wafer level chip scale packaging

5. Understanding the use of silicone gels for nonhermetic plastic packaging