Low stress polyimide/silica nanocomposites as dielectrics for wafer level chip scale packaging
Author:
Funder
National Research Foundation of Korea
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
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3. Photoacoustic effect on the electrical and mechanical properties of polymer-infiltrated carbon nanotube fiber/graphene oxide composites
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5. Low-dielectric polyimide nanofoams derived from 4,4′-(hexafluoroisopropylidene)diphthalic anhydride and 2,2′-bis(trifluoromethyl)benzidine
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