Temporary bonding system with photopolymer release layer for 365nm UV debonding without laser-Reference-Cited by-同舟云学术

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Temporary bonding system with photopolymer release layer for 365nm UV debonding without laser

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Wang Xuefan¹,Liu Qiang¹,Wang Fangcheng¹,Li Jinhui¹,Li Zhipeng¹,Dai Wenxue¹,Huang Mingqi²,Li Kang¹,Bai Yun¹,Zhang Guoping¹,Sun Rong¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

2. Samcien Semiconductor Materials Co., Ltd.,Research and development department,Shenzhen,China,518055

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873370.pdf?arnumber=9873370

Reference6 articles.

1. Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling

2. Thin Wafer Handling Challenges and Emerging Solutions

3. Thin Si wafer substrate bonding and de-bonding below 250 °C for the monolithic 3D integration

4. UV laser releasable temporary bonding materials for FO-WLP

5. Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31

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