Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling-Reference-Cited by-同舟云学术

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Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
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Short-container-title:

Author:

Zoschke K.¹,Fischer T.¹,Topper M.¹,Fritzsch T.¹,Ehrmann O.²,Itabashi Toshiaki³,Zussman Melvin P.⁴,Souter Matthew⁵,Oppermann H.¹,Lang K.-D.²

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration - IZM, Gustav-Meyer-Allee 25, 13355 Berlin, Germany

2. Technical University of Berlin, Gustav-Meyer-Allee 25, 13355 Berlin

3. Hitachi Chemical DuPont MicroSystems Ltd., 1-4-25, Kohraku, Bunkyo-ku, Tokyo, 112-0004 Japan

4. HD MicroSystems, Dupont Experimental Station, PO Box 80334, Wilmington, DE 19880-0334, USA

5. Tamarack Scientific, 220 Klug Circle, Corona, CA, 92880 USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06248966.pdf?arnumber=6248966

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review;Materials;2023-12-14

2. Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages;ACS Applied Polymer Materials;2022-10-17

3. Temporary bonding system with photopolymer release layer for 365nm UV debonding without laser;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. A Study on the Mechanical Debonding Process through Static-Elastic Stress Analysis for 3-D Wafer Level Packages (WLPs);2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

5. Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications;Microelectronic Engineering;2019-04

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