Investigation on rheological behavior and jet printing process of the solder pastes
Author:
Affiliation:
1. Nanjing Research Institute of Electronics Technology,Nanjing,China,210039
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873444.pdf?arnumber=9873444
Reference15 articles.
1. Precision Jetting of Solder Paste – A Versatile Tool for Small Volume Production
2. Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes
3. A jetting system for chip on glass package
4. Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process
5. Composite inks of poly(3,4-ethylenedioxythiophene)/poly(styrenesulfonate)/silver nanoparticles and electric/optical properties of inkjet-printed thin films
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