A jetting system for chip on glass package
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5234372/5270539/05270564.pdf?arnumber=5270564
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation on rheological behavior and jet printing process of the solder pastes;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
2. Use of a 6-axis robot and ink piezo-jetting to print conductive paths on 3D objects. Printed circuit geometry, and conductivity predictive model;CIRP Journal of Manufacturing Science and Technology;2021-11
3. Design and Experiment of a Moving Magnet Actuator Based Jetting Dispenser;Applied Sciences;2019-07-20
4. Optimal Design of Jetting Configuration for Robust Performance;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-07
5. Novel consistency control strategy for jet dispensing;Journal of Central South University;2018-06
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