Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process-Reference-Cited by-同舟云学术

Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

Published:2011-06 Issue:6 Volume:32 Page:3189-3197
ISSN:0261-3069
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Amalu E.H.,Ekere N.N.,Mallik S.

Publisher

Elsevier BV

Subject

Applied Mathematics,General Mathematics

Reference31 articles.

1. Aravamudhan S, Santos D, Pham-Van Diep G, Andres F. A study of solder paste release from small stencil apertures of different geometries with constant volumes. In: Proc of IEEE transaction on technology symposium: international electronics manufacturing technology (IEMT) symposium. SEMICON West; 2002. p. 159–65.

2. Amalu EH, Ekere NN, Bhatti RS. High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: Proc of 2nd international conference on adaptive science & technology. Accra Ghana; 14–16 December, 2009. p. 146–53.

3. Critical variables of solder paste stencil printing for micro-BGA and fine –pitch QFP;Pan;IEEE Trans Electron Pack Manuf,2004

4. Amalu EH, Lau WK, Ekere NN, Bhatti RS, Otiaba KC, Tarkyi G. A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Revised version receiving attention in Microelectron Eng J.

5. Mallik S, Thieme J, Bauer R, Ekere NN, Seman A, Bhatti R, Durairaj R. Study of the rheological behaviours of Sn–Ag–Cu solder paste and their correlation with printing performance. In: Proc of 11th electronics packaging technology conference. Singapore; December 2009. p. 869–73.

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