Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. Reflow profile study of the Sn‐Ag‐Cu solder
2. A study of the thin film on the surface of Sn–3.5Ag/Sn–3.5Ag–2.0Cu lead-free alloy
3. Lead-Free Bumping Using an Alternating Electromagnetic Field
4. Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint
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