Author:
Peng Yan,Tang Liping,Sun Yaqian,Hu Anmin,Li Ming
Funder
National Key Research and Development Program of China
National Natural Science Foundation of China
Shanghai Jiao Tong University
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference27 articles.
1. Recent progress in SLID bonding in novel 3D-IC technologies;Sun;J. Alloy. Compd.,2020
2. Recent advances and trends in advanced packaging;Lau;IEEE Trans. Compon. Packaging Manuf. Technol.,2022
3. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011
4. M.H. Chan, C. Chuang, Y.L. Huang, W.J. Chen, D.S. Jiang, C.M. Huang, C.K. Chung, Comparison of 3D Packages with 20μm bump pitch using reflow soldering and thermal compression bonding, in: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021, pp. 481–486, doi: 10.1109/ECTC32696.2021.00087.
5. W. Zhang, W. Ruythooren, Characterization of oxidation of electroplated sn for advanced flip-chip bonding; Characterization of oxidation of electroplated sn for advanced flip-chip bonding, 2009.
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