AI-enabled Automatic Molding Compound Selection for A Power Device with High Solder Joint Reliability
Author:
Affiliation:
1. Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong,China
2. Packaging R&D Nexperia HK Ltd.,Hong Kong,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873400.pdf?arnumber=9873400
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1. Physics-based Nested-ANN Approach for Fan-Out Wafer-Level Package Reliability Prediction
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