Physics-based Nested-ANN Approach for Fan-Out Wafer-Level Package Reliability Prediction
Author:
Affiliation:
1. Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong SAR,China
2. Hong Kong University of Science and Technology,Smart Manufacturing Thrust, Systems Hub,Guangzhou,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816435.pdf?arnumber=9816435
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