Author:
Yao Peilun,Chen Haibin,Yang Jinglei,Wu Jingshen
Cited by
3 articles.
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1. Application of AI-enabled Simulation in Power Package Development;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. AI-enabled Automatic Molding Compound Selection for A Power Device with High Solder Joint Reliability;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. Physics-based Nested-ANN Approach for Fan-Out Wafer-Level Package Reliability Prediction;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05