1. FCCSP Warpage Scope Evaluation for 5G Product with Advanced Wafer Node;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
2. Interface StressAnalysis Based on Warpage Characterization in a Flip-Chip Package;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. A Study on Evaluating the Risk of Underfill Delamination During Thermal Cycling by Finite Element Analysis;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
4. Method of Improving Simulation Accuracy by Curing Shrinkage of Molding Compound;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
5. Warpage Variation Analysis and Model Prediction for Molded Packages;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05