Method of Improving Simulation Accuracy by Curing Shrinkage of Molding Compound
Author:
Affiliation:
1. ZTE Sanechips,Department of Packaging and Testing,Shen zhen,China
2. Multimedia Technology,State Key Laboratory of Mobile Network and Mobile,Shen zhen,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872552.pdf?arnumber=9872552
Reference6 articles.
1. Model and simulation of Warpage in packaged IC strips after Mold Array Process
2. Impact of Mold Compound Cure Shrinkage on Substrate Block Warpage Simulation
3. A feasible method to predict thin package actual warpage based on an FEM model integrated with empirical data
4. Simulation and Validation of FBGA Package Warpage by Considering Viscoelastic Effect;tan;Advanced Package Technologies,0
5. Warpage Modeling of Ultra-Thin Packages Based on Chemical Shrinkage and Cure-Dependent Viscoelasticity of Molded Underfill
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Improvement of Warping Simulation Accuracy and Influence Factors Analysis in FCBGA Package;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
2. Warpage of transfer-molded automotive power modules – experimental characterization, numerical simulation and optimization;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Warpage Simulation Including Effect of Process and MC Curing Shrinkage;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
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