A Study on Evaluating the Risk of Underfill Delamination During Thermal Cycling by Finite Element Analysis-Reference-Cited by-同舟云学术

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A Study on Evaluating the Risk of Underfill Delamination During Thermal Cycling by Finite Element Analysis

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhong Cheng¹,Li Chenglong¹,Jiang Ruoyu¹,Li Yulong¹,Peng Xu¹,Li Gang¹,Zhu Pengli¹,Lu Jibao¹,Sun Rong¹

Affiliation:

1. Chinese Academy of Science,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

Funder

National Natural Science Foundation of China

Youth Innovation Promotion Association

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872616.pdf?arnumber=9872616

Reference18 articles.

1. Fundamentals of delamination initiation and growth in flip chip assemblies

2. Lifetime of Solder Joint and Delamination in Flip Chip Assemblies;cheng;Int Business of Electronic Product Reliability and Liability Conf,2004

3. Characterization and Verification of Viscoelastic Constitutive Parameters of Underfill Material

4. Viscoelastic Characterization and Simulation of Thermal Interface Materials

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