Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints-Reference-Cited by-同舟云学术

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Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Su Sinan,Hoque Mohd Aminul,Chowdhury Md Mahmudur,Hamasha Sad,Suhling Jeffrey C.,Evans John L.,Lall Pradeep

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811415.pdf?arnumber=8811415

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

2. A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

5. Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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