Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints

Author:

Su Sinan,Hoque Mohd Aminul,Chowdhury Md Mahmudur,Hamasha Sad,Suhling Jeffrey C.,Evans John L.,Lall Pradeep

Publisher

IEEE

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

2. A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

5. Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3