A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading-Reference-Cited by-同舟云学术

A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Mazumder Golam Rakib¹,Haq Mohammad Ashraful¹,Suhling Jeffrey C.¹,Lall Pradeep¹,Chen Yaxiong²,Hauck Torsten³,Fahim Abdullah²

Affiliation:

1. Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University,Auburn,AL,USA,36849

2. NXP Semiconductors,Austin,TX,USA

3. Munich,GERMANY

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195782.pdf?arnumber=10195782

Reference20 articles.

1. Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles;hasan;Proceedings of the 72nd IEEE Electronic Components and Technology Conference,0

2. Mechanical Property Evolution in SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposure Profiles

3. Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints

4. Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

5. Damage Evolution in SAC Solder Alloys

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analytical and experimental studies on the damage evolution of SAC solder alloys;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17