Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

Author:

Matin M.A.,Vellinga W.P.,Geers M.G.D.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 52 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Correlation of Mechanical and Microstructural Evolutions in Lead Free Solders Subjected to Various Thermal Exposures;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Microstructure characterization and elastic-plastic self-consistent simulation studies of anisotropic deformation of β-tin;International Journal of Plasticity;2023-09

3. Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks;Journal of Materials Research and Technology;2023-09

4. The Effects of Thermal Exposure on the Creep Behavior of SAC+Bi Lead-Free Solders;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

5. Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

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