Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference20 articles.
1. Impact of microstructure evolution on the long-term reliability of wafer-level chip-scale package Sn–Ag–Cu solder interconnects;Lee;IEEE Trans Compon Packag Manuf Technol,2020
2. Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package;Zhang;J Adv Join Process,2022
3. Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy;Lee;J Electron Mater,2010
4. Thermal and mechanical characterization of 2.5-D and fan-out chip on substrate chip-first and chip-last packages;Shih;IEEE Trans Compon Packag Manuf Technol,2022
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