Analytical and experimental studies on the damage evolution of SAC solder alloys-Reference-Cited by-同舟云学术

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Analytical and experimental studies on the damage evolution of SAC solder alloys

Published:2023-04-17 Issue: Volume: Page:
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Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Glane S.¹,Morozov A.¹,Müller W.H.¹,Hauck T.²,Mazumder G.R.³,Haq M.A.³,Suhling J.³

Affiliation:

1. Institute of Mechanics, Faculty V of Mechanical Engineering and Transport Systems, Berlin Institute of Technology Einsteinufer 5,Berlin,Germany,10587

2. NXP Semiconductors, Schatzbogen 7,München,Germany,81829

3. Auburn University,CAVE3,Auburn,AL,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100753.pdf?arnumber=10100753

Reference10 articles.

1. SciPy 1.0: fundamental algorithms for scientific computing in Python

2. Array programming with NumPy

3. Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation;schubert;Electronic Components and Technology Conference,1999

4. The Creep Parameters of SAC305 Unleaded Solders

5. A continuum damage mechanics approach for the reliability of lead-free solders subjected to cyclic loading;mazumder;2023 IEEE 73nd Electronic Components and Technology Conference (ECTC),2023

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