Subject
General Engineering,General Materials Science
Cited by
2 articles.
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1. Analytical and experimental studies on the damage evolution of SAC solder alloys;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. Finite Element Analysis for Reliability of Solder Joints Materials in the Embedded Package;Electronic Materials Letters;2019-02-12