Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling
Author:
Affiliation:
1. Auburn University,Department of Mechanical Engineering, and Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3),Auburn,AL,36849
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816400.pdf?arnumber=9816400
Reference43 articles.
1. Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing
2. Evolution of the Properties of SAC-Bi-Ni-Sb Lead Free Solder During Mechanical Cycling
3. Effects of Mechanical Cycling on the Microstructure of SAC305 Lead Free Solder;chowdhury;Proceedings of ITherm 2018,2018
4. Microstructure evolution in a Pb-free solder alloy during mechanical fatigue
5. Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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