Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling-Reference-Cited by-同舟云学术

Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Haq Mohammad Ashraful¹,Hoque Mohd Aminul¹,Mazumder Golam Rakib¹,Suhling Jeffrey C.¹,Lall Pradeep¹

Affiliation:

1. Auburn University,Department of Mechanical Engineering, and Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3),Auburn,AL,36849

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816400.pdf?arnumber=9816400

Reference43 articles.

1. Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

2. Evolution of the Properties of SAC-Bi-Ni-Sb Lead Free Solder During Mechanical Cycling

3. Effects of Mechanical Cycling on the Microstructure of SAC305 Lead Free Solder;chowdhury;Proceedings of ITherm 2018,2018

4. Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

5. Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical Characterization and Modeling of iSAC Lead-Free Solder;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

3. A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05