Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders-Reference-Cited by-同舟云学术

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Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders

Published:2008-05 Issue: Volume: Page:
ISSN:
Container-title:2008 58th Electronic Components and Technology Conference
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Short-container-title:

Author:

Che F.X.,Luan J.E.,Baraton Xavier

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550016.pdf?arnumber=4550016

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints;Materials;2022-10-13

2. Reliability of SAC Solders under Low and High Stress Conditions;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

3. Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints;Journal of Electronic Packaging;2022-03-31

5. Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints;Microelectronics Reliability;2021-12

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