Developments of high-Bi alloys as a high temperature Pb-free solder
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897464.pdf?arnumber=6897464
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Influence of Second Phase Particles on Thermal Conductivity of Bi Alloys;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-03
2. Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05
3. Lead-Free Alternatives for Interconnects in High-Temperature Electronics;Journal of Electronic Packaging;2018-03-01
4. Bi2(C2O4)3·7H2O and Bi(C2O4)OH Oxalates Thermal Decomposition Revisited. Formation of Nanoparticles with a Lower Melting Point than Bulk Bismuth;Inorganic Chemistry;2017-08-03
5. Bismuth-Based Transient Liquid Phase (TLP) Bonding as High-Temperature Lead-Free Solder Alternatives;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05
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