Bismuth-Based Transient Liquid Phase (TLP) Bonding as High-Temperature Lead-Free Solder Alternatives
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999888.pdf?arnumber=7999888
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Influence of Second Phase Particles on Thermal Conductivity of Bi Alloys;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-03
2. Work of adhesion and reactive wetting in SnPb/Cu,Ni and SnBi/Cu,Ni soldering systems;Materials Characterization;2021-08
3. Study on Microstructure and Shear Property of Cu/In-xCu/Cu Transient Liquid Phase Bonding Joints;Journal of Electronic Materials;2020-10-10
4. Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding;Journal of Materials Science: Materials in Electronics;2020-08-01
5. Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding;Electronic Materials Letters;2020-05-21
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