Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding-Reference-Cited by-同舟云学术

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Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Published:2020-05-21 Issue:4 Volume:16 Page:347-354
ISSN:1738-8090
Container-title:Electronic Materials Letters
language:en
Short-container-title:Electron. Mater. Lett.

Author:

Min Kyung Deuk,Jung Kwang-Ho,Lee Choong-Jae,Jeong Haksan,Hwang Byeong-Uk,Jung Seung-Boo

Funder

Ministry of Education

Ministry of Trade, Industry and Energy

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s13391-020-00221-4.pdf

Reference29 articles.

1. Chin, H.S., Cheong, K.Y., Ismail, A.B.: A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices: Metal. Mater. Trans. B 41(4), 824–832 (2010)

2. Zhang, H., Chen, C., Nagao, S., Suganuma, K.: Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices. J. Electron. Mater. 46(2), 1055–1060 (2017)

3. Neudeck, P.G., Okojie, R.S., Chen, L.Y.: High-temperature electronics a role for wide bandgap semiconductors. Proc. IEEE 90, 1065–1076 (2002)

4. Tatsumi, K., Inagaki, M., Kamei, K., Lizuka, T., Narimatsu, H., Sato, N., Shimizu, K., Ueda, K., Imakire, A., Hikita, M., Kamimura, R., Sugiura, K., Tsuruta, K., Tsuruta, K.: Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application. 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1316–1321: (2017)

5. Soichi, S., Suganuma, K.: Low-Temperature and Low-Pressure Die Bonding Using Thin Ag-Flake and Ag-Particle Pastes for Power Devices. IEEE Trans. Compon. Packag. Manuf. Technol. 3(6), 923–929 (2013)

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1. The transient liquid phase bonding by ultrasonic-assisted soldering of Cu contained Sn-58Bi solder paste for high-temperature packaging applications;2022 International Conference on Electronics Packaging (ICEP);2022-05-11

2. Study on the Kinetics of Ni3Sn4 Growth and Isothermal Solidification in Ni-Sn TLPS Bonding Process;Metallurgical and Materials Transactions A;2022-02-27

3. Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints;Frontiers in Materials;2021-06-17

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