Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application-Reference-Cited by-同舟云学术

Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Tatsumi Kohei,Inagaki Masakazu,Kamei Kazuhito,Iizuka Tomonori,Narimatsu Hiroaki,Sato Nobuaki,Shimizu Koji,Ueda Kazutoshi,Imakiire Akihiro,Hikita Masayuki,Kamimura Rikiya,Sugiura Kazuhiko,Tsuruta Kazuhiro,Toda Keiji

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999851.pdf?arnumber=7999851

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