The transient liquid phase bonding by ultrasonic-assisted soldering of Cu contained Sn-58Bi solder paste for high-temperature packaging applications
Author:
Affiliation:
1. Sungkyunkwan University,School of Advanced Materials Science & Engineering,Suwon,Republic of Korea,16419
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795586.pdf?arnumber=9795586
Reference6 articles.
1. Enhancing the solid/liquid interfacial metallurgical reaction of Sn+Cu composite solder by ultrasonic-assisted chip attachment
2. Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints
3. The shear strength of transient liquid phase bonded Sn–Bi solder joint with added Cu particles
4. Intrinsic and Interdiffusion in Cu-Sn System
5. Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding
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