Intrinsic and Interdiffusion in Cu-Sn System-Reference-Cited by-同舟云学术

Intrinsic and Interdiffusion in Cu-Sn System

Published:2011-05-13 Issue:4 Volume:32 Page:309-319
ISSN:1547-7037
Container-title:Journal of Phase Equilibria and Diffusion
language:en
Short-container-title:J. Phase Equilib. Diffus.

Author:

Kumar Santosh,Handwerker Carol A.,Dayananda Mysore A.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11669-011-9907-9.pdf

Reference40 articles.

1. Q. Xu and A. Van der Ven, First-Principles Investigation of Migration Barriers and Point Defect Complexes in B2-NiAl, Intermetallics, 2009, 17(5), p 319-329

2. R.S. Kejun Zeng, T.-C. Chiu, D. Edwards, K. Ano, and K.N. Tu, Kirkendall Void Formation in Eutectic SnPb Solder Joints on Bare Cu and Its Effect on Joint Reliability, J. Appl. Phys., 2005, 97(2), p 024508-8

3. Th. Massalski, Ed., Binary Alloy Phase Diagrams, American Society for Metals, Metals Park, OH, 1986

4. P. Borgesen and D.W. Henderson, Fragility of Lead-Free Solder Joints, Binghamton University, New York, 2004

5. L. Xu and J.H.L. Pang, Effect of Intermetallic and Kirkendall Voids Growth on Board Level Drop Reliability for SnAgCu Lead-Free BGA Solder Joint, 56th Electronic Components and Technology Conference and Proceedings, 2006, p 275-282

Cited by 95 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints;Materials Characterization;2024-10

2. The role of Sn grain orientation in Cu depletion of Sn-based solders;Modelling and Simulation in Materials Science and Engineering;2024-07-05

3. Void Growth and Intermetallic Bridging in Microscale Solder Interconnects Under Thermal Annealing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

4. Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples;Journal of the Taiwan Institute of Chemical Engineers;2024-02

5. Inhibition of roof-type Cu6Sn5 grains on migration of Cu atoms under temperature gradient;Journal of Materials Science;2023-12-27