Author:
Eslampour Hamid,Lee SeongMin,Park SeongWon,Lee TaeKeun,Yoon InSang,Kim YoungChul
Cited by
9 articles.
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1. Reliability of Indium Solder Joints using a Laser-Assisted Bonding (LAB) Process at Room Temperature;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
3. Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. The Electrical and Thermal Characteristics of Stacked GaN MISHEMT;Micromachines;2022-11-28
5. Cost Comparison of
FO‐WLP
with Other Technologies;Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces;2021-12-03