Warpage Control of Liquid Molding Compound for Fan-Out Wafer Level Packaging-Reference-Cited by-同舟云学术

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Warpage Control of Liquid Molding Compound for Fan-Out Wafer Level Packaging

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Oi Yosuke,Fujii Yasuhito,Hiraoka Takashi,Yada Yukio,Kan Katsushi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429661.pdf?arnumber=8429661

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel sheet molding compound technology for wafer-level packaging to overcome wafer warpage issue;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Warpage Control Technology using 300 mm Waffle Wafer Evaluated by High-Precision FEM Analysis;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

3. Precise Warpage Control Technology for 12-Inch Bumpless Via-Last Chip-on-Wafer (COW) by Finite Element Method (FEM);2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

4. Scalable Through Molding Interconnection realization for advanced Fan Out Wafer Level Packaging applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

5. Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-02

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