Novel sheet molding compound technology for wafer-level packaging to overcome wafer warpage issue-Reference-Cited by-同舟云学术

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Novel sheet molding compound technology for wafer-level packaging to overcome wafer warpage issue

Published:2024-05-28 Issue: Volume: Page:855-859
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Sugiura Yuki¹,Mori Daisuke¹,Fujii Yasuhito¹,Imamura Kenta²,Yamai Ippei³,Yagihashi Takashi¹,Nomura Eiichi¹

Affiliation:

1. Nagase ChemteX Corporation,Product Development Division,Tatsuno, Hyogo,Japan

2. Nagase America LLC,Sales & Business Development,San Jose,CA,USA

3. Nagase & Co., Ltd.,Advanced Functional Materials Dept.,Chiyoda-Ku, Tokyo,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565017.pdf?arnumber=10565017

Reference7 articles.

1. Warpage Control of Liquid Molding Compound for Fan-Out Wafer Level Packaging

2. Warpage Suppression during FO-WLP Fabrication Process

3. Ultra-Thin 50 um Fan-Out Wafer Level Package: Development of an Innovative Assembly and De-bonding Concept

4. A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory

5. Technology of packaging by Liquid Mold-Underfill (MUF) material for advanced mobile devices

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