Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages-Reference-Cited by-同舟云学术

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Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

Published:2022-02 Issue:2 Volume:12 Page:297-305
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Shih Meng-Kai^ORCID,Lai Weihong,Liao Tsewei,Chen Karen,Chen Dao-Long,Hung C. P.^ORCID

Funder

Ministry of Science and Technology, Taiwan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9718121/09690518.pdf?arnumber=9690518

Reference38 articles.

1. Thermal Analysis of 2.5D Package in High Power Application

2. Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

3. Constitutive models of creep for lead-free solders

4. Design for reliability (DFR) methodology for electronic packaging assemblies

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3. Highly Functional Materials for Advanced Package;Journal of Photopolymer Science and Technology;2024-06-25

4. A Novel Chip-on-Board Defect Detection Approach Combining Infrared Thermal Evolution and Self-Supervised Transformer;IEEE Transactions on Industrial Informatics;2024-05

5. Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials;Applied Energy;2024-02

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