Thermal Analysis of 2.5D Package in High Power Application-Reference-Cited by-同舟云学术

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Thermal Analysis of 2.5D Package in High Power Application

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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Author:

Han Yong,Li Hongyu,Lim Sharon Seow Huang,Kawano Masaya

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9006769/9026560/09026647.pdf?arnumber=9026647

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions;Materials;2023-06-09

2. Comprehensive thermal investigation of Antenna in Package for SATCOM On The Move;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-02

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