Constitutive models of creep for lead-free solders-Reference-Cited by-同舟云学术

Constitutive models of creep for lead-free solders

Published:2009-07 Issue:14 Volume:44 Page:3841-3851
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Ma Hongtao

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/article/10.1007/s10853-009-3521-9/fulltext.html

Reference30 articles.

1. Garofalo F (1966) Fundamentals of creep and creep-rupture in metals. The Macmillan Company, USA

2. Hertzberg RW (1996) Deformation and fracture mechanics of engineering materials, 4th edn. John Wiley & Sons Inc, NY

3. Evans RW, Wilshire B (1985) Creep of metals and alloys. The Institute of Metals, London

4. Mukherjee AK, Bird JE, Dorn JE (1969) Trans Am Soc Met 62:155

5. Clech JP. Review and analysis of lead-free materials properties, NIST, Available at: https://doi.org/www.metallurgy.nist.gov/solder/clech/Sn-Ag-Cu_Main.htm

Cited by 48 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigating the Evolution of Creep Properties During Thermal Cycling of Homogeneous Lead-Free Solder Joints;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

2. Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents;Soldering & Surface Mount Technology;2023-08-28

3. Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics;The Journal of Strain Analysis for Engineering Design;2023-07-31

4. Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2023-06-02

5. Predicting the Life of the Solder Joints in Electronic Assemblies using Physics-informed Data-driven Methodology;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30