A Novel Chip-on-Board Defect Detection Approach Combining Infrared Thermal Evolution and Self-Supervised Transformer
Author:
Affiliation:
1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
Funder
Major Program of Hubei Province
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/9424/10521545/10462592.pdf?arnumber=10462592
Reference27 articles.
1. Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages
2. Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution
3. A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry
4. Development and validation of a digital twin framework for SMT manufacturing
5. Online Dynamic Detection of Hazardous Cracks in Train Wheels by Probe Combination: Based on Classical Piezoelectric Ultrasonic Technology
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